INTAMSYS HT Enhanced Technical Details
| 220V Version FUNMAT HT Enhanced Specifications | ||
| SIZE & WEIGHT | Printer Size | 543 × 501 × 645 mm |
| Packing Size | 780 × 650 × 890 mm | |
| Printer Weight | 63kg | |
| Packing Weight | 76kg | |
| ENVIRONMENTAL | Operating Temperature | 15~32°C |
| Operating Humidity | 30%~70% | |
| Storage Temperature | 0°C~54°C | |
| Storage Humidity | 10%~85% | |
| MECHANICAL | Build Plate | Ceramic Glass |
| Cooling System | Fan Cooling | |
| Resolution | XY: 12.5um Z: 1.25um | |
| ELECTRICAL | Input | 200-240V~, 6A, 50/60Hz, Single phase |
| MAX Power | 1200W | |
| Connectivity | USB | |
| Touch Screen | 3.2" | |
| Safety Protection | Over Current | |
| Regulatory Compliance | CE, SGS, FCC | |
| PRINTING | Printing technology | FFF (Fused Filament Fabrication) |
| Build Volume | 260 x 260 x 260 mm | |
| Layer Thickness | 0.05~0.4mm( 0.15-0.25mm recommened) | |
| Printing Nozzles | Single | |
| MAX Travel Speed | XY: 200mm/s | |
| MAX Print Speed | XY: 160mm/s | |
| Nozzle Diameter | 0.25, 0.4, 0.6 and 0.8mm Selectable. Default 0.4mm, | |
| Spools | 1 | |
| Filament Diameter | 1.75mm | |
| Filament Type | PEEK, PEEK-CF, PEEK-GF, PEKK, PC, PC-ABS, PA, PA-CF, ASA, ABS, HIPS, SP3030 etc. | |
| Camera | Yes | |
| Leveling | Auto-leveling With High-precision Sensors | |
| Nozzle Temperature | Max. 450°C | |
| Build Plate Temperature | Max. 160°C | |
| Chamber Temperature | Max. 90°C | |
| Smart Monitor & Control | Filament Absence Warning, Power Failure Recovery，Camera monitoring function | |
| SOFTWARE | Slicing Software | INTAMSUITE NEO |
| Supported File Types | .stl/.3mf/.obj/.x3d/.g/oltp/.stp//.step/.iges | |
| Host Platform | Windows | |